In 2022, Desay SV begins to deploy SIP, a vehicle-level business integrating design and manufacturing. It is expected to be put into production in August, which marks the beginning of Desay SV's expansion into the system-in-package field.

It is reported that Desay SV is also the first enterprise in Chinese automotive electronics field to deploy SIP business.

SIP refers to system-in-package, which integrates active and passive components with different functions, as well as functional chips such as micro-electro-mechanical systems (MEMS), optical (Optic) components, processors, and memories in one package. This makes it a single standard packaged component that provides multiple functions, forming a fully functional subsystem.

Compared with system integration on a printed circuit board, SIP can maximize system performance, avoid duplication of packaging, shorten development cycles, reduce costs, and improve integration efficiency.

Desay SV made a lot of preparations in the early stage, learned and mastered the key technologies of SIP, and adopted fully automatic ball planting equipment with good stability, high repeatability, and self-feedback of ball planting quality to improve product quality and efficiency. It uses double-sided multi-angle online spray cleaning equipment to ensure product cleanliness and uses high-precision, high-efficiency, high-temperature-resistant, and void-free dispensing technology to improve product reliability.

Desay SV will continue to invest hundreds of millions of capital to create a fully automated SIP line with high precision and high stability in the industry, and its annual production capacity is expected to exceed 1.5 million units within two years.